A coreless technology overview for packaging substrates

The rational of using the coreless technology to build packaging substrates versus the conventional core approach is first described. Substrate structures are compared to illustrate the simplicity and advantages of the coreless approach over that of the core. Coreless product examples, including the design rules are shown for both the ABF and the BT/Hitachi materials. Developmental results of the coreless technology indicated that the panels are stable and the electrical performance is superior to that of the core technology approach.