Updated results of R&D on Functionally Innovative 3D-Integrated Circuit (Dream Chip) technology in FY2009

In the NEDO "Dream Chip Project", ASET has been entrusted a project for developing, "Functionally Innovative 3D-Integrated Circuit". In the five year project from 2008 to 2012, development on technologies for design environment, chip test, interposer, cooling and stacking/bonding, thin wafer, and development on demonstration device, process and 3D Reconfigurable Device Technology are being performed.