Characterizing mechanical performance of Board Level Interconnects for In-Circuit Test

Lead Free boards are more susceptible to mechanical stress and therefore more prone to damage during manufacturing, assembly and field use. The IPC/JEDEC 9707(Spherical Bend Test Method for Characterization of Board Level Interconnects) was developed to characterize the mechanical performance of new lead free materials (i.e. laminates), board design features (i.e. pad design), and components (i.e. BGAs). This paper describes the application of the new IPC/JEDEC 9707 standard to qualify the mechanical performance of board interconnects for manufacturing and In-Circuit Test. The efforts of the International Electronics Manufacturing Initiative (iNEMI) Board Flexure Initiative Project team drove the development of this new IPC/JEDEC 9707standard.