Advanced chemical downstream etch and strip capability

Semiconductor manufacturing has slowly but surely been moving from wet etch and strip towards all-dry processing. With the advent of dry isotropic chambers on cluster tool platforms, it is now more attractive than ever to integrate several wet/dry steps into a single all-dry sequence. Target applications include isotropic oxide etch, high-selectivity nitride and poly strip and a variety of soft etches for damage, contaminant and residue removal.