Spectral reflectance as a non-destructive SIMOX quality evaluation technique

Summary form only given. Spectral reflectance analysis versus wavelength can provide quick and valuable, non-destructive, information about the quality of SIMOX wafers prior to device fabrication in addition to thickness information. Advantages of commercial tools include; precision stages for automated patterned wafer measurements, speed, and a variety of spot sizes ranging from as small as 2.7 /spl mu/m/spl times/2.7 /spl mu/m to as large as 400 /spl mu/m/spl times/300 /spl mu/m. Use of the technique prior to processing can screen out suspect batches, identifying them for more intensive and destructive investigation. Device measurements were made on material with suspect reflectometry results. Device carrier lifetime and BVdss are reported. In addition, cross section Transmission Electron Micrographs (TEM) were taken to clarify physical attributes.