Optimization of TAB inner lead bonding process

Delamination has occurred at the adhesive which is subject to thermal damage. The heat from the hot bonding tool transfers to the adhesive through the leadframe and degrades the thermally weak adhesive during the TAB ILB (inner lead bonding) process. It is essential to retain the temperature at the adhesive below its degradation temperature. In this study, the effect of the temperature of the heat cartridge in the bonding tool and the dwell time on degradation of the adhesive was investigated, using finite volume method. As a result, the optimized process condition avoiding degradation of the adhesive was proposed. In addition, the effect of this temperature on bondability of the Au bump was also taken into consideration.