CHIPPAC-interconnect technology development in Europe. A European collaborative project within ESPRIT

Cost effective high performance packaging of electronic systems is critical to the market success of modern electronic products. CHIPPAC is a 2.5 year, European Union (ESPRIT) sponsored, multinational, collaborative project involving 11 partners. The aim of CHIPPAC is to develop and compare technology options available for exploitation in products today. Work tasks in the project look at the real issues of design for manufacture by the inclusion of demonstrator system units. In parallel, technology tasks produce the knowhow and hardware for these demonstrators. Whilst the whole project is actively involved in most of the issues that concern our industry (e.g. Known Good Die, assembly, electrical performance, thermal management), this presentation concentrates on the work between Bull SA in France and GEC-Marconi in the UK concerning the manufacture and comparison of high density printed circuit boards for applications deploying MCMs and advanced BGA packages.