Interconnection and assembly of LCDs

The LCD market is demanding larger displays with higher resolution in smaller, thinner, lighter packages at lower cost. As LCD displays were designed to meet these market needs, new interconnection and assembly technologies were required. For some applications final product packaging is a dominant product differentiator. Interconnection between conductors on the glass LCD cell and the drive electronics has evolved from coarse pitch conductive elastomers to heat seal connectors to anisotropic conductive film bonded tape carrier packages to direct chip attachment, with the older technologies retaining certain market niches. The overall display package has become thinner and lighter with the deployment of newer packaging and interconnection technologies. This paper reviews the evolution of interconnection technology in the display industry from coarse pitch conductive elastomers to fine direct chip attachment. Trends in tape carrier package and direct chip attachment technology are emphasized. Industry trends in display packaging and examples of product differentiation through improved packaging are discussed.