Multi-physics characterization of through silicon vias (TSV) in the presence of a periodic EMP

Multi-physics characterization of multi-layered stacked through silicon vias (TSVs) is performed based on the hybrid time-domain finite element method (FEM), with most temperature-dependent material parameters treated appropriately. Using our developed algorithm, numerical computation is carried out so as to capture transient electro-thermo-mechanical responses of different TSV geometries injected by a periodic EMP, where the effects of thermal accumulation and induced thermal stress are predicted accurately and analyzed in detail. The provided information will be useful for us to enhance TSV reliability.