Novel electrical modelling and measurement technique of hybrid package (FusionQuad) for characterization of RF and high speed signals

This paper discuss electrical characterization of new developed hybrid package, FusionQuad, that is converging QFN and TQFP type package to have good electrical performance with high I/O pin counts. Precise electrical modelling from wire-to-motherboard is performed by using simple organic based test die with de-embedding technique to cope with limits of assembly process. Measurements are done in the frequency domain to extract S-parameter up to 10 GHz.