Development of epoxy resin composites with high thermal conductivity

High-performance central processing units (CPUs) and power devices such as IGBTs have high electrical power dissipation, which causes substantial heating. As a result, efficient cooling is essential for insulating materials within such devices. Although polymers such as epoxy resins are good insulating materials, they have quite low thermal conductivities, usually 1 to 3 orders of magnitude lower than those of ceramics and metals. Thus, the development of insulating resin with high thermal conductivity is mandatory if operating temperatures are to be increased.