The influences of temperature cycling parameters on the reliability of the solder joints in the high-density package assemblies by Taguchi Method

Electronic packages nowadays are becoming smaller, lighter with higher I/O count and better performance that are more cost competitive. Therefore, some critical problems under temperature cycling need to be addressed to improve the qualities of IC devices. As a beginning, this paper will compare a series of results of the literature to prove the correctness of simulation analysis and ensure this research credibility. The first part of this study will use finite element analysis and Taguchi method to understand the influences of the temperature cycling loading on fatigue life of three different integrated circuit packages. A L
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orthogonal array contains five factors, and each one has four levels, then the noise factors are three package models, namely PBGA-256, PBGA-388, and CCGA-1657, respectively. In the design of temperature cyclic parameters, the range of the high temperature and the dwell time of low temperature are the main parameters affecting the fatigue life prediction. In between, the variation of the lower temperature dwell time is more important. High temperature dwell time and temperature ramp rate have smaller influences on the fatigue life of the 3 packages. The low dwell temperature has the least influence in the whole design of the parameters. The purpose of investigation with Taguchi method is not to obtain the optimal parameters of the thermal cycling and it is to examine the effects of temperature cycling parameter of solder joint reliability for these lead-free materials.