3-D finite-element modeling of multi-finger high-power amplifiers with compact heat-dissipation packaging structures

The temperature distribution of heat-dissipation structures has been designed using the 3-D thermal FEM method. Results on multi-finger InGaP C-up HBTs demonstrate that the thickness of heat-dissipation packaging configurations can be further reduced by 40%, and the achieved heat-dissipation performance will not be deteriorated. From this efficient analysis, it is believed that miniaturization of C-up HBTs with compact heat-dissipation structures can be used in small-scale HPAs.