A new method for via capacitance control for high speed PCB design

Modern printed circuit board design involves more than just interconnecting components, as complex high speed applications requires special concerns regarding signal integrity and electromagnetic compatibility. In order to fulfill this request, the designer need specialized software tools for modeling and electrical analysis of the physical structure of the board. This paper propose a new design technique aimed to control the capacitances of signal vias, which take advantage of the linear scaling of the electrical and geometrical characteristics of the vias.