Reliability of novel die attach adhesive for snap curing

Novel adhesive, using in-line process, has been shown to reduce adhesive cure cycle time from 70 minutes to as little as 44 seconds at 160/spl deg/C. Throughput improvement of 60% using existing box ovens and no increase in floor space has been confirmed on production equipment. The adhesive is based upon a modified cyanate ester resin, which cures to form a triazine polymer with excellent temperature stability and unique moisture properties. It generates 75% less outgassing during cure than typical snap sure epoxies, which reduces contamination of the chip, leadframe and oven chamber. Live device reliability, equivalent to standard box oven, has been demonstrated for the new snap cure adhesive using in-line cure, as well as, fast box oven process. Material, processing and qualification data is summarized and compared to epoxies for analog and logic ICs packaged in SOIC, PDIP, and PLCC body styles. The material has been fully qualified and is in production use.