Coplanar bond wire interconnections for millimeter-wave applications

An investigation of bond wire interconnections for coplanar integrated millimeter-wave circuits is presented. Assuming a transmission line behaviour of the bond wire its characteristic impedance and propagation constant are calculated using two dimensional finite element simulations. The model is validated by comparison with experimental data and then used to estimate the maximum length for bond wires in millimeter-wave applications. Bond wire matching networks are introduced giving a broadband improvement in the behaviour of interconnections with long wires.