Ground path inductance characterization of a 225PBGA

This paper presents the measured L data of the ground (V/sub SS/) structure of a 225PBGA by using a two-port network analyzer technique. The ground structure of this package has eight source points (bond wire sites) and one sink point (solder ball site). Measurement data is presented in terms of an 8/spl times/8 matrix for the V/sub SS/ L path. Experimental procedure and its implications are discussed.