A high performance MCM-D using Cu/fluoropolymer thin film multilayer technology

A new high performance MCM-D technology has been developed utilizing Copper conductors and CPFP (Cyclized-Perfluoropolymer) dielectrics. The cyclized-perfluoropolymer has a dielectric constant of around 2.0 and a tan /spl sigma/ of 7.0/spl times/10/sup -4/ at 1 GHz. Conductor metallization adhesion on CPFP was measured at 2 Kg/mm/sup 2/ with the addition of a adhesive thin film metal. Adhesion of the conductor metallization to the via hole structure is achieved by dry etch processing. A test vehicle was fabricated with four conductor layers (Gnd/Sig/Sig/Grn). Signal transmission line electrical performance was measured by the Time-Domain Reflection (TDR) method. The test vehicle had excellent electrical characteristics. A propagation delay of 48.9 ps/cm was achieved.