Q-TAT production and CIM systems for the packaging process within IC fabrication

The time required for the processes from die bonding through molding could be reduced to less than half a day by introducing improved production systems, new processes, and the CIM system. Thus, a CIM line capable of flexible small-lot production of multiple product variations could be constructed. In addition, the time required for input to the packaging process through packing was reduced to half that of the conventional system, thus achieving a QTAT line. Productivity was also enhanced to 1.5 times that of the conventional system.