Heat transport from a chip

The heat transport from a chip due to conduction and interphase heat transfer from the chip to the surrounding air are investigated. Experiments with thin diaphragms of silicon nitride, which can be heated by a thin-film resistor, were performed. The heat losses of the devices were measured in vacuum and in air. The influence of temperature, geometry, and heat sinks was investigated. Heat transfer is described by the transfer coefficient, which is a function of the temperature and the size of the chip. The calculated heat losses are in good agreement with the experimental values.<
>