Reliability of an Electronic Assembly: A Case History

This article describes the work done in evaluating the reliability of a printed-circuit-card assembly. Some assemblies went through thermal shock, humidity, and power-temperature cycling. A model was developed for interpreting a long term, high temperature life-test. Two iterations of the life test took place as part of the evaluation. A short term, intermediate temperature life-test of a relatively large number of assemblies preceded release to manufacturing.