Polymer/metal composite for interconnection technology

In this paper, we report on the the rheological, electrical and mechanical properties of paste which is composed of a thermoplastic polymer, solvent and silver particles, and the resulting polymer/metal composite (PMC) which forms after the solvent from the paste has dried. We will refer to the two states as paste and PMC. The paste properties indicate the applicability of the material for fine feature size interconnects such as required for flip-chip-attach. The adhesive and electrical properties of PMC demonstrates that this material will be suitable as an interconnect media in high performance applications. Furthermore, the system chosen is reworkable and the bonding process is volatile-free (i.e. the solvent may be completely removed prior to the bonding step).