Hole grid array (HGA)-a new tape carrier package with high count I/O

In recent years, high-speed and high-integration CMOS LSI has been requested for supercomputers and very large general-purpose computers. Such LSI has problems of many I/O pins and high heat generation. Consequently, a package which satisfies such requirements and which enables surface packaging is needed. On the other hand, mean while, there is a problem of how to lower the cost of such a package for lowering the costs of supercomputers and very large general-purpose computers. Introduced herein is the HGA (Hole Grid Array) package that we have developed to satisfy those requirements.