Analysis of lossy multi-chip module interconnections using finite element method

In this paper, a new comprehensive electromagnetic modeling tool, the networking distributed transmission line parameters, R(/spl omega/), L(/spl omega/), C(/spl omega/), and G(/spl omega/), is developed. The modal characteristic impedances, network functions, and multiconductor transmission lines stamp of pulse propagation in interconnects are derived. For signals with subnanosecond rise times, the interconnects always behave as transmission lines. Multichip module MCMs are the emerging technology for an advanced electronic packaging. This technology has the advantages of smaller size, lighter systems, and improved performance. The interconnect circuit parameters vary with frequency. Two- or three-dimensional finite elements, are used to solve the fields in terms of the magnetic vector potential and scalar potential. The loss analysis has taken into account the skin effect, proximity effect, and lossy dielectric material in the problem. The accuracy of the method is studied by comparison with available data in the literature.