Study of FCMBGA with low CTE core substrate

Amkor's FC
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BGA, flip chip package based on transfer molding for high performance device was developed and introduced to industry in 2008[1,2]. During the molding process, bump deformation was not significant, and voids were not observed under flip chip die. Coplanarity with a low Coefficient of Thermal Expansion, CTE, substrate construction was similar to a single piece lidded package construction. Coplanarity at high temperature did not change significantly with low CTE substrate compared to standard substrates. The flip chip package with molding passed reliability test such as Moisture Resistance Testing, MRT, and Thermal Cycling, TC 1500 cycles. No delamination or cracks were observed.