Control of internal stress of Co-Cr films deposited by facing targets sputtering

The reduction of excessively large internal stress to zero has been succeeded by adjusting working gas pressure to the proper value in the range below 1 mtorr in a facing targets sputtering (FTS) system. In addition, the internal stress depends on the distance between facing targets in the FTS system. The origins of such a change of internal stress can be attributed to the bombarding effect by energetic particles recoiled at the target's surface with a high ejection angle.<
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