Design of test modules for the analysis of MCM interconnects

Summary form only given. A thin-film Multichip Module (MCM-D) switching unit, specifically designed for performance analysis of interconnection substrates, is described. A test approach is presented for the characterisation of a given device technology as a function of geometrical, physical and electrical quantities-in this particular case, a MCM-D technology and a 0.7 /spl mu/m CMOS technology.