Improvement of RF performance of GaAs/Si MESFETs using buried oxygen implantation

A novel buried oxygen implantation (BOI) procedure is described to reduce parasitics and improve RF performance of GaAs/Si MESFETs. Devices fabricated with this procedure show output conductance of less than 8.5 mS/mm which is the lowest reported to date for GaAs/Si MESFETs. These results are particularly important to improve the power performance of GaAs/Si MESFETs.