Surface-mount plastic packages-an assessment of their thermal performance

The characteristics of surface mount (SM) plastic packages such as SOICs (small outline ICs) PLCCs (plastic leaded chip carriers), and FPPLCCs (fine pitch PLCCs) used in IC packaging are described. Experimental data are reported on single-component packages in free air, forced air, and liquid immersion cooling environments. Parameters of a model to help a system thermal designer to best utilize the single-component thermal data are discussed. The influence of both the package variables (such as leadframe design, chip size, and heat spreader) and user variables (such as PC board material, board level package density, and cooling mode) on the package thermal performance is assessed. Opportunities to enhance the SM plastic packages' thermal performance are identified, and their prospects are assessed.<
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