Measurement of package inductance and capacitance matrices

A technique is presented for the measurement of resistance, inductance, conductance, and capacitance matrices of large pin count electronic packages. Circuit analysis of an assumed lumped model is used to define a measurement technique based on two sets of measurements on specially prepared samples. Formulas are derived for use with network analyzer measurements. Measurements and simulations on a 208-lead quad flat pack show that the method attains good accuracy for all but the small values of the conductance matrix.