A room temperature flip-chip mounting technique for laser diodes on silicon motherboards

In this presentation, a relatively simple mounting method is suggested for flip-chip mounting of arrays of edge-emitting laser diodes to arrays of fibers. What really makes the difference with known methods is the use of a room temperature mounting process using a transparent UV-curing, non conducting glue for the fixation of arrays of laser diodes. Apart from power budget problems, the only problem to be solved was the influence of the glue on the laser facets. This has been solved by the application of coatings.