Adhesion Promotion Technology for Semi-Additive Process

The increased functionality of today's advanced electronics, such as multi-function mobile equipment, is driven by semiconductor technology development. The added functionality of semiconductor and passive devices increase circuit density and decrease the available assembly space in the device. Packaging substrates are controlled by semiconductor trends. As semiconductor chip performance improves, the substrates and packaging technologies must keep pace. This paper discusses a unique Adhesion Promotion Process designed for the semi-additive fabrication of advanced flip-chip packaging substrates. In these applications, 2-D measurements, such as Ra (average roughness), have been the traditional parameters specified to control surface quality. In this article we will explore how 3D parameters can be employed to provide greater insight into surface finish and performance. In particular, we will focus on characterizing the effects of carrier films surface at each step of the adhesion promotion process, using 3-D surface profile parameters.