Reworking Lead-Free Array Packages on Double Sided Printed Circuit Boards

Whether using lead-bearing or lead-free processes, and whether reworking conventional or array package components, the principal steps in rework, (desoldering, removal, site cleaning and reattachment) remain largely the same. This article proposes to focus on heating, the biggest issue introduced by lead-free rework, and how best to reflow array package components on large double-sided printed circuit boards (PCBs).