Via2 - Laser Embedded Conductor Technology 2008 The 3rd IMPACT and 10th EMAP Joint Conference

The innovative embedded circuit approach utilizes an advanced laser ablation technique to form electrical paths for signal propagation within the dielectric, as opposed to conventional technologies, that form signal propagation on the dielectric materials. This technology reveals numerous benefits and opportunities to address the needs of the advanced silicon nodes in the chip packaging industry. The embedded circuit approach offers a unique opportunity to simultaneously: (1) Improve upon incremental changes in design (2) Optimize electrical performance by reducing signal paths and proximating grounds for shielding (3) Drive miniaturization. A collaborative effort between Amkor Technology, Unimicron and Atotech, has led to a significant new breakthrough in substrate manufacturing techniques, allowing both layer and format reduction (thus cost reduction) versus current state of the art technologies. The tremendous growth and need for a disruptive technology in the flip chip packaged technology sector, has helped to facilitate the implementation of this new method that allows the miniaturization of both design features and substrate format. This innovative technology utilizes laser ablation techniques, together with specially developed plating processes, to form electrical paths for signal propagation within the dielectric, as opposed to conventional technologies that form signal paths above the dielectric layer. This paper is the first part of a two-part paper co-authored by Atotech and Amkor Technology (Ron Huemoeller). The papers, when read in sequence, describe the opportunity to reduce the number of vias and layers in the substrate, the unique opportunity to optimize electrical performance, and the potential miniaturization in design as a result. A close look at this technology reveals the clear benefits and opportunity for significant gap closure required by the chip packaging industry today.