A Miniaturized Wafer-Scale Package Demonstrated with Three Enhancement Mode Amplifiers

This paper presents a 1 mm times 0.5 mm times 0.25 mm miniaturized package fabricated using internal E-PHEMT 6" wafers and industry-first Wafer-Scale Packaging technology. To demonstrate this technology, a set of three distinct amplifiers were developed. The 1-12 GHz 50-Ohm gain block operates with a 5 V, 55 mA supply and achieves 14 dB gain, 3.7 dB NF, 28 dBm OIP3 and 17 dBm OP1dB. The 0.5-6 GHz Bypass LNA requires a 5 V, 24 mA supply and has 14.5 dB gain, 2 dB NF in the gain state. The low-voltage LNA operates with a 1.8 V, 20 mA and produces 14.3 dB gain, 2.2 dB NF and -3 dBm IP-1 dB. These three SMT compatible products are unique and industry-leading in all aspects of performance, packaging and cost.