Plastic Packaging Using Low Frequency Induction Heating (LFIH) For Microsystems

Microfluidic systems are being used in more and more areas and the demand for such systems is growing every day. Hence, a cheap and rapid method for sealing these microfluidic platforms which can be used for mass manufacture is needed. In this paper low frequency induction heating (LFIH) is presented as technique for the packaging of polymer based microfluidic systems. Thin metal layers serving as susceptors are introduced between a stack of polymer slides and heated inductively. The generated heat melts the surrounding polymer and creates a bond. Preliminary work reported here has demonstrated such bonds are able to withstand a pressure of up to 590 kPa, that both ferro- and paramagnetic susceptors are suitable for the bonding process, and that even small metal features can be rapidly heated to a temperature of 200 °C. In addition simulations and validating experiments have been carried out to understand control of the heat dissipation in the workpiece.