A Novel Electromagnetic Bandgap Structure for Broadband Switching Noise Suppression in High-Speed Printed Circuit Boards

The use of vias as interconnection structure in high-density system on package (SoP) substrates and printed circuit boards (PCBs) is the most common solution to route signals in multilayer structures. However this configuration poses a problem in term of simultaneous swithching noise (SSN) producing false switching in digital circuits and malfunctioning in analog circuits. The purpose of this work is to present a novel planar electromagnetic bandgap (EBG) structure which is able to overcome this drawback within a large bandwidth (1.0 GHz - 6.6 GHz) with a good suppression level (less than -30 dB) and also along a wide range of directions.