A study on broadband switching noise reduction by embedding high-density thin-film capacitor in a laminate package

Broadband noise reduction has been investigated by embedding a high-density thin-film decoupling capacitor as much as 1 μF in a laminate package. A complex programmable logic device (CPLD) was mounted on the laminate package instead of bare chip as a noise generating circuits. Then, the package was mounted on an evaluation board. Eight output buffer circuits of the CPLD were simultaneous switched. Switching noise between the power and ground pads on the package has been dramatically reduced by the existence of high-density thin-film decoupling capacitance inside the package.