Removal of wire bond die using a three step process

The focus of this paper is the description of three processes that can be used for the removal of wirebond attached devices. The equipment described is relatively simple to install and can easily be used by manufacturing personnel. These cost effective methods of reworking this type of device are useful when multi-chip modules require repair after testing or where other defects have been found. Instead of discarding the module, a replacement can be made. Replacement procedures make effective use of engineering parts that may require changes. This is true for single chip modules as well.<
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