Known good die for MCMs: Enabling technologies

Summary form only given, as follows. The need for known good die for MCMs has been widely recognized. However, satisfying this need has presented many test challenges. Fortunately, the efforts of many workers are now providing the basic technology to assure the performance and reliability of die to be used in MCMs. Performance testing of ICs and chips on wafers is illustrated at gigahertz rates with improvements possible using membrane probes. The recent development of rapid thermal stressing for quick burn-in of ICs presents the possibility of avoiding chip carriers. The point of this paper is to emphasize the availability of effective test methods for known good die and to provide the reader with a solid reference base from which to choose the most appropriate method.<
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