N-Channel MOSFETs With Embedded Silicon–Carbon Source/Drain Stressors Formed Using Cluster-Carbon Implant and Excimer-Laser-Induced Solid Phase Epitaxy

In this letter, we report the use of a novel cluster-carbon (C
₇
H
₇

⁺
) implant and pulsed-excimer-laser-induced solid-phase-epitaxy technique to form embedded silicon-carbon (Si:C) source/drain (S/D) stressors. A substitutional carbon concentration C
_sub
of ~ 1.1% was obtained in this letter. N-channel MOSFETs (n-FETs) integrated with embedded silicon-carbon (Si:C) S/D stressors formed using the novel cluster-carbon implant and pulsed-laser-anneal technique demonstrate improvement in current drive of 14% over control n-FETs formed with Si preamorphization implant. I
_OFF
I
_DSAT
comparison shows a 15% I
_DSAT
enhancement for n-FETs with embedded Si:C S/D at an I
_OFF
= 1 nA/mum despite a slightly higher series resistance.