Multi-level electro-thermal modeling for circuit simulation of packaged power devices

This paper explores a coupled electro-thermal modeling approach based on the integration of analytical compact models of semiconductor physics with a distributed three-dimensional description of thermal phenomena. The main motivation for the development of novel approaches resides in the increasing integration level of power components and equipment, which is pushing the validity of essentially-1D compact thermal models (i.e., RC-Networks) to their limit. Distinctive features of the proposed solution are great flexibility as regards the level of detail that needs to be considered (chip, substrate, heat-sink; 2D or 3D) and the suitability to describe diverse aspect-ratios and shapes. The resulting models are apt for use in general purpose circuit simulators (e.g., Saber, Simplorer) and to be coupled with realistic control and drive signals, enabling a more accurate and in-depth characterization of assembled devices.