New metallic substrates for high thermal efficient TEC

We made new ceramic coated metal substrates for TEC. The new metal substrates were coated dense alumina ceramics by using Plasma Electrolytic Oxidation technique. The thickness of alumina ceramic coatings on the metal substrates is between 5 mum to 30 mum according to coating time and electrical pulse current. The ceramic coated metal substrates for TEC give high thermal conductivity than the alumina ceramic substrate which has large thermal lag as well as poor thermal conductivity. Furthermore they could give a direct attachment with TEC elements to the metal heat sink typically aluminum, so we can make high efficient TEC. The high efficient TEC with new metallic substrates gives many benefits such as low consuming energies with longer existing potable coolers, and small and compact TE coolers which has no cooling fan, and so without noisy sound. The measured amount of heat absorption Q
_c
was 22.2~21.6 lower than ordinary Al
₂
O
₃
substrate because of polymer adhesion between the new metallic substrate and TEC elements. Z
_M
was almost same, 2.61~2.28. If non-electroplating method or metallizing paste technique would be applied to bonding the elements, the efficiency will be increased.