Simulation of Moisture Diffusion in Sealing Layers by using Analogous Thermal Simulation

This paper presents a numerical model for the simulation of moisture absorption in packaged microsystems based on analogy between mechanical and thermal diffusion equations. This approach could be useful when certain simulation software, such as CoventorWare, does not have the capability of moisture diffusion simulation. We present the first results concerning the simulation of moisture absorption and time necessary to reach a certain concentration of moisture in the package. Also, the obtained distribution of moisture concentration inside the package's material could be further used for simulation of hygroscopic stress through hygroswelling.