Study of Discrete Capacitor Embedded Process and Characterization Analysis in Organic-Base Substrate

In this study, an integrated process flow to place more than one discrete chip-type passive components in multilayer organic substrate by build via is presented, reliability test by JEDEC standard is shown too. The phenomenon of simultaneous switch noise (SSN) reduce by decoupling capacitor is measured and simulated by high frequency probing technology and full-wave 3D electromagnetic simulation tools.