Packaging Challenges for Miniaturized SOT Packages

The paper presents the packaging challenges faced in the development of miniaturized SOT(D)-723 packages. It drew from the two packages development experiences whereby Flat Lead packages of 1.2 mm times 0.8 mm times 0.5 mm (SOT-723) and 1.0 mm times 0.6 mm times 0.5 mm (SOD-723) were successfully developed and introduced commercially. The products are used mainly on hand-held applications where form factor is important consideration. Due to reduced package profile, several packaging solutions were developed: (i) Development of thin wafer sawing process to minimize die crack and back chip defects; (ii) Low stress die attach technology to reduce packaging process stress and enhance die bond integrity; and (iii) Development of special molding compound material and process design to enhance moldability and minimize potential wire sweep problem.