In-situ study on the effects of temperature and size on the electromigration characteristics of eutectic SnPb and Pb-free solder alloys

The article consists of a Powerpoint presentation on electromigration characteristics eutectic SnPb and Pb-free solder alloys. The paper concludes that fundamental electromigration characteristics of eutectic SnPb and SnAgCu lines is obtained using in-situ SEM observation. Alloying effect on existence of incubation time. Incubation stage exists in eutectic SnPb due to the preceding Pb migration, while there was no incubation stage in SnAgCu because it acts as nearly pure Sn phase. Temperature effect on dominant migration phases and hillock phases in eutectic SnPb. Line length effect on incubation time & threshold current density in eutectic SnPb.