Suppression of Microwave Resonances in Wirebond Transitions Between Conductor-Backed Coplanar Waveguides

Suppression of microwave resonances in wirebond transitions is reported. The transition is made between conductor-backed coplanar waveguides on two different substrates (alumina and silicon), and multiple wirebonds connecting two grounds on each substrate are shown to remove the resonances. It is shown that this additional wirebonding eliminates the nodes which are responsible for the unwanted resonant modes with the frequencies far below the first resonant frequency (19 GHz) of the single substrates. Our work is a unique demonstration of using multiple wirebonds for the removal of resonances.