Low profile multi-layer slotted Substrate Integrated Waveguide (SIW) array antenna with folded feed network for mobile DBS applications

A low profile Substrate Integrated Waveguide (SIW) 13x32 slot array antenna has been fabricated employing multi-layer printed circuit board technology. The introduction of multi-layer structures considerably reduced the overall height of the mobile antenna to about 3in. and rendered a low profile antenna structure suitable for mobile DBS reception. On the top substrate layer in this well-developed design, the radiating slot elements were etched on the metalized top surface, and a low loss feed structure comprised of SIW elements was similarly printed using the bottom substrate. The top and bottom layers were coupled through transverse slots cut at the interface of two layers. This newly developed antenna is a low profile design as folding the antenna feed has resulted in a significant height reduction, and the use of the inherent main beam tilt angle of the leaky wave antenna has considerably reduced the mechanical steering requirements. The complete design details will be presented here.