Profiled Ceramic Micropackages for MEMS Application

The present paper refers to realization of profiled ceramic micropackages (leadless inverted devices) for the mounting of MEMS application. Also the paper presents the possibility of mounting of MEMS components on profiled ceramic micropackages through original method gold-gold diffusion. Using corundum ceramic and electronic purity materials, the ceramic micropackages have been realized by adapting technological processes (deposition of metallic films, etching, etc.) and equipment specific to the electronic component industry. Generally speaking, profiled and metal ceramic bonds can be formed in two ways in plane where the ceramic elements are coplanar soldered and in space where the metallic and ceramic elements are realized according to a cylindrical geometry. For either way the metal-ceramic is manufactured, various (eutectic) performs of high temperature as a rule, are used.